Ceva and Mobilint are collaborating to advance Physical AI with the REGULUS Edge AI SoC, using Ceva-NeuPro Nano and Ceva-SensPro IP to bring perception and AI inference to intelligent edge devices.
Ceva and Mobilint are collaborating to advance Physical AI with the REGULUS Edge AI SoC, using Ceva-NeuPro Nano and Ceva-SensPro IP to bring perception and AI inference to intelligent edge devices.
Ceva is the leader in silicon and software IP that enable smart edge devices to connect, sense and infer data more reliably and efficiently.
First production deployment of Ceva's NeuPro NPU family combines NeuPro-Nano with SensPro AI DSP to deliver advanced sensing and inference capabilities for Physical AI devices
ROCKVILLE, Md. and SEOUL, South Korea, Nov. 2, 2026 /PRNewswire/ -- As AI becomes embedded across the physical world, workloads are increasingly being processed where they can run most effectively and efficiently, from the cloud to the device itself. For Physical AI systems that must sense, interpret and respond to their surroundings in real time, this is driving greater intelligence directly into power-constrained edge devices. Ceva, Inc. (NASDAQ: CEVA), the leader in silicon and software IP for the Smart Edge, today announced that Mobilint, a leading AI semiconductor company, has deployed Ceva's SensProâ„¢ AI DSPÂ and NeuPro-Nanoâ„¢ NPUÂ in its REGULUS edge AI System-on-Chip (SoC), marking the first production deployment of Ceva's NeuPro NPU family.