First production deployment of Ceva's NeuPro NPU family combines NeuPro-Nano with SensPro AI DSP to deliver advanced sensing and inference capabilities for Physical AI devices

ROCKVILLE, Md. and SEOUL, South Korea, Nov. 2, 2026 /PRNewswire/ -- As AI becomes embedded across the physical world, workloads are increasingly being processed where they can run most effectively and efficiently, from the cloud to the device itself. For Physical AI systems that must sense, interpret and respond to their surroundings in real time, this is driving greater intelligence directly into power-constrained edge devices. Ceva, Inc. (NASDAQ: CEVA), the leader in silicon and software IP for the Smart Edge, today announced that Mobilint, a leading AI semiconductor company, has deployed Ceva's SensPro™ AI DSP and NeuPro-Nano™ NPU in its REGULUS edge AI System-on-Chip (SoC), marking the first production deployment of Ceva's NeuPro NPU family.

Recommended for you